姓  名:吴建鹏(毕业校友)
研究方向:  智能材料
获得学位: 博士学位
毕业去向:南昆士兰大学
  


 
  1. 2019年12月获得蒋震奖学金

  2. 2021年10月获得国家奖学金

  3. 2021年12月获得重点实验室学术年会优秀报告奖

  4. 2023年10月获得国家奖学金

  5. 2023年12月获得第五届工程科学学院研究生学术年会优秀报告奖

 
 
  1. Wu JP, Zhang JS, Sang M, Li ZM, Zhou JY, Wang Y, Xuan SH, Leung KC, Gong XL

    Acid-assisted toughening aramid aerogel monoliths with ultralow thermal conductivity and superior tensile toughness (Supporting information)

    Advanced Functional Materials, 34:2307072, 2024(SCI工程技术1区)

  2. Wu JP, Sang M, Zhang JY, Sun YX, Wang XY, Zhang JS, Pang HM, Luo TZ, Pan SS, Xuan SH, Gong XL

    Ultra-stretchable spiral hybrid conductive fber with 500%-strain electric stability and deformation-independent linear temperature response (Supporting information)

    Small, 19:2207454, 2023(SCI工程技术1区)

  3. Wu JP, Wang Y, Zhang JS, Zhao CY, Fan ZY, Shu Q, He XK, Xuan SH, Gong XL
    A lightweight aramid-based structural composite with ultralow thermal conductivity and high-impact force dissipation(Supporting information)
    Matter, 5: 2265-2284, 2022(SCI工程技术1区)

  4. Wu JP, Pang HM, Ding L, Wang Y, He XK, Shu Q, Xuan SH, Gong XL
    A lightweight, ultrathin aramid-based flexible sensor using a combined inkjet printing and buckling strategy
    Chemical Engineering Journal, 421:129830, 2021(SCI工程技术1区)